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<P>ThefocusofthisbookistomergethecomplexCMPmodelsandmechanismsthathaveevolvedinthepastdecadewithrecentexperimentalresultswithcopperandlow-dielectricconstant(low-andhigh-removal-rateprocesses.Theresultisamorein-depthlookintothefundamentalreactionkineticsthatalter,selectivelyconsume,andultimatelyplanarizeamulti-materialstructureduringDamascenepatterning.</P>Assemiconductormanufacturersimplementcopperconductorsinadvancedinterconnectschemes,researchanddevelopmenteffortsshifttowardtheselectionofaninsulatorthatcantakemaximumadvantageofthemainchallengestointegratingalow-dielectricconstant(low-kappaCMPtodevelopacomprehensivemechanismforlow-andhigh-removal-rateprocesses.Theresultisamorein-depthlookintothefundamentalreactionkineticsthatalter,selectivelyconsume,andultimatelyplanarizeamulti-materialstructureduringDamascenepatterning.Low-kappa)insulatorasareplacementforsilicondioxideisthebehaviorofsuchmaterialsduringthechemical-mechanicalplanarization(CMP)processusedinDamascenepatterning.</P>画面が切り替わりますので、しばらくお待ち下さい。
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